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Green Manufacturing and Sustainable Manufacturing Partnership

Research in the LMAS is concerned with the analysis and improvement of manufacturing processes and the development of tools to analyze sustainability. Research projects address: metrics and analytical tools for assessing the impact of processes including design for sustainability, systems and enterprises, modeling sustainable, environmentally-conscious manufacturing processes and systems, green supply chains, manufacturing technology for reduced impact, manufacturing technology for producing advanced energy sources or storage cleantech and sustainable products and systems. Specifically, research is focused on minimizing/removing contaminants and machining defects during manufacture, improving the precision and repeatability of chemical mechanical polishing, green machine tools and processes, sustainable packaging, and modeling sustainable, environmentally-conscious manufacturing processes and systems. The main lab groups within the LMAS are Precision Manufacturing, Green Engineering, and SMP (the Sustainable Manufacturing Partnership). An earlier research effort CODEF (Consortium on Deburring and Edge Finishing) has completed its work. Each of these groups conduct research with an eye to sustainability, and maintain a common goal of reducing waste (time, energy, materials).

There are 126 publications in this collection, published between 2003 and 2014. Showing 101 - 126.

Zhang, Teresa; Dornfeld, David: Energy Use per Worker-Hour: Evaluating the Contribution of Labor to Manufacturing Energy Use, 2007

Zhang, Teresa; Bates, Sarah W.; Dornfeld, David: Operational Energy Use of Plasmonic Imaging Lithography, 2007

Ávila, Miguel C.; Gardner, Joel D.; Reich-Weiser, Corinne; Vijayaraghavan, Athulan; Dornfeld, David: Strategies for Burr Minimization and Cleanability in Aerospace and Automotive Manufacturing, 2006

Boyd, Sarah; Dornfeld, David; Krishnan, Nikhil: Life Cycle Inventory of a CMOS Chip, 2006

Hartnett, Jeffrey; Min, Sangkee; Dornfeld, David: Micromachining and Burr Formation for Precision Components, 2006

Lee, D. E.; Hwang, I.; Valente, C. M. O.; Oliviera, J. F.G.; Dornfeld, D. A.: Precision Manufacturing Process Monitoring with Acoustic Emission, 2006

Li, Xiaochun; Wong, Chee Wei; Dornfeld, David; Thomas, Brian: Research on Subwavelength Microphtonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments, 2006

Yuan, Chris; Zhang, Teresa; Rangarajan, Arvind; Dornfeld, David; Ziemba, Bill; Whitbeck, Rod: A Decision-Based Analysis of Compressed Air Usage Patterns in Automotive Manufacturing, 2006

Zhang, Teresa; Boyd, Sarah; Vijayaraghavan, Athulan; Dornfeld, David: Energy Use in Nanoscale Manufacturing, 2006

Boyd, Sarah; Dornfeld, David A: Technology Choices for the PV Industry: A Comparative Life Cycle Assessment, 2005

Dornfeld, David; Chu, Chih-Hsing: Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits, 2005

Dornfeld, David: Micromachining and Burr Formation for Precision Components, 2005

Iturrospe, Aitzol; Dornfeld, David; Atxa, Vicente; Abete, José M.: Bicepstrum Based Blind Identification of the Acoustic Emission (AE) Signal in Precision Turning, 2005

Lee, Sunghoon; Kim, Hyoungjae; Dornfeld, David: Development of a CMP Pad with Controlled Micro Features for Improved Performance, 2005

Merchant, Eugene M.; Wright, Paul K.; Dornfeld, David: Manufacturing — Its Evolution and Future, 2005

Vijayaraghavan, Athulan; Dornfeld, David A.: Challenges in modeling machining in multilayer materials, 2005

Zhang, Teresa: Ecological Footprint Budgeting: Environmental Analysis of the Generic American Car, 2005

Boyd, Sarah; Dornfeld, David A: QSAR Tools in Environmental Analysis for the Semiconductor Industry, 2004

Chu, C-H; Dornfeld, D: Linking tool paths generated with different offset distances for edge quality enhancement in planar milling, 2004

Krishnan, Nikhil; Raoux, Sebastien; Dornfeld, David: Quantifying the Environmental Footprint of Semiconductor Equipment Using the Environmental Value Systems Analysis (EnV-S), 2004

Krishnan, Nikhil; Raoux, Sebastién; Dornfeld, David: Quantifying the Environmental Footprint of Semiconductor Equipment using the Environmental Value Systems Analysis (EnV-S), 2004

Krishnan, N.; Boyd, S.; Rosales, J.; Dornfeld, D.; Raoux, S.; Smati, R.: Using a Hybrid Approach to Evaluate Semiconductor Life Cycle Environmental Issues: A Case Study in Interconnect Module Impacts, 2004

Lee, Kiha; Dornfeld, David A.: A Study of Surface Roughness in the Micro-End-Milling Process, 2004

Ayyagary, Uday; Krishnan, Nikhil; Rosales, Joaquin; Dornfeld, David A: Integrated Life-cycle Assessment for Semiconductor Manufacturing Processes using the Environmental Value Systems Analysis and EIOLCA, 2003

Broomes, Peter; Dornfeld, David A: HVAC Modeling for Cost of Ownership Assessment in Biotechnology & Drugs Manufacturing, 2003

Krishnan, Nikhil; Ayyagary, Uday; Dornfeld, David A: The Environmental Value Systems Analysis - Research Report for 2002, 2003

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