Green Manufacturing and Sustainable Manufacturing Partnership
Research in the LMAS is concerned with the analysis and improvement of manufacturing processes and the development of tools to analyze sustainability. Research projects address: metrics and analytical tools for assessing the impact of processes including design for sustainability, systems and enterprises, modeling sustainable, environmentally-conscious manufacturing processes and systems, green supply chains, manufacturing technology for reduced impact, manufacturing technology for producing advanced energy sources or storage cleantech and sustainable products and systems. Specifically, research is focused on minimizing/removing contaminants and machining defects during manufacture, improving the precision and repeatability of chemical mechanical polishing, green machine tools and processes, sustainable packaging, and modeling sustainable, environmentally-conscious manufacturing processes and systems. The main lab groups within the LMAS are Precision Manufacturing, Green Engineering, and SMP (the Sustainable Manufacturing Partnership). An earlier research effort CODEF (Consortium on Deburring and Edge Finishing) has completed its work. Each of these groups conduct research with an eye to sustainability, and maintain a common goal of reducing waste (time, energy, materials).
There are 126 publications in this collection, published between 2003 and 2014. Showing 101 - 126.
Zhang, Teresa; Dornfeld, David: Energy Use per Worker-Hour: Evaluating the Contribution of Labor to Manufacturing Energy Use, 2007
Zhang, Teresa; Bates, Sarah W.; Dornfeld, David: Operational Energy Use of Plasmonic Imaging Lithography, 2007
Ávila, Miguel C.; Gardner, Joel D.; Reich-Weiser, Corinne; Vijayaraghavan, Athulan; Dornfeld, David: Strategies for Burr Minimization and Cleanability in Aerospace and Automotive Manufacturing, 2006
Boyd, Sarah; Dornfeld, David; Krishnan, Nikhil: Life Cycle Inventory of a CMOS Chip, 2006
Hartnett, Jeffrey; Min, Sangkee; Dornfeld, David: Micromachining and Burr Formation for Precision Components, 2006
Lee, D. E.; Hwang, I.; Valente, C. M. O.; Oliviera, J. F.G.; Dornfeld, D. A.: Precision Manufacturing Process Monitoring with Acoustic Emission, 2006
Li, Xiaochun; Wong, Chee Wei; Dornfeld, David; Thomas, Brian: Research on Subwavelength Microphtonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments, 2006
Yuan, Chris; Zhang, Teresa; Rangarajan, Arvind; Dornfeld, David; Ziemba, Bill; Whitbeck, Rod: A Decision-Based Analysis of Compressed Air Usage Patterns in Automotive Manufacturing, 2006
Zhang, Teresa; Boyd, Sarah; Vijayaraghavan, Athulan; Dornfeld, David: Energy Use in Nanoscale Manufacturing, 2006
Boyd, Sarah; Dornfeld, David A: Technology Choices for the PV Industry: A Comparative Life Cycle Assessment, 2005
Dornfeld, David; Chu, Chih-Hsing: Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits, 2005
Dornfeld, David: Micromachining and Burr Formation for Precision Components, 2005
Iturrospe, Aitzol; Dornfeld, David; Atxa, Vicente; Abete, José M.: Bicepstrum Based Blind Identification of the Acoustic Emission (AE) Signal in Precision Turning, 2005
Lee, Sunghoon; Kim, Hyoungjae; Dornfeld, David: Development of a CMP Pad with Controlled Micro Features for Improved Performance, 2005
Merchant, Eugene M.; Wright, Paul K.; Dornfeld, David: Manufacturing — Its Evolution and Future, 2005
Vijayaraghavan, Athulan; Dornfeld, David A.: Challenges in modeling machining in multilayer materials, 2005
Zhang, Teresa: Ecological Footprint Budgeting: Environmental Analysis of the Generic American Car, 2005
Boyd, Sarah; Dornfeld, David A: QSAR Tools in Environmental Analysis for the Semiconductor Industry, 2004
Chu, C-H; Dornfeld, D: Linking tool paths generated with different offset distances for edge quality enhancement in planar milling, 2004
Krishnan, Nikhil; Raoux, Sebastien; Dornfeld, David: Quantifying the Environmental Footprint of Semiconductor Equipment Using the Environmental Value Systems Analysis (EnV-S), 2004
Krishnan, Nikhil; Raoux, Sebastién; Dornfeld, David: Quantifying the Environmental Footprint of Semiconductor Equipment using the Environmental Value Systems Analysis (EnV-S), 2004
Krishnan, N.; Boyd, S.; Rosales, J.; Dornfeld, D.; Raoux, S.; Smati, R.: Using a Hybrid Approach to Evaluate Semiconductor Life Cycle Environmental Issues: A Case Study in Interconnect Module Impacts, 2004
Lee, Kiha; Dornfeld, David A.: A Study of Surface Roughness in the Micro-End-Milling Process, 2004
Ayyagary, Uday; Krishnan, Nikhil; Rosales, Joaquin; Dornfeld, David A: Integrated Life-cycle Assessment for Semiconductor Manufacturing Processes using the Environmental Value Systems Analysis and EIOLCA, 2003
Broomes, Peter; Dornfeld, David A: HVAC Modeling for Cost of Ownership Assessment in Biotechnology & Drugs Manufacturing, 2003
Krishnan, Nikhil; Ayyagary, Uday; Dornfeld, David A: The Environmental Value Systems Analysis - Research Report for 2002, 2003