Precision Manufacturing Group
Research in the LMAS is concerned with the analysis and improvement of manufacturing processes and the development of tools to analyze sustainability. Research projects address: metrics and analytical tools for assessing the impact of processes including design for sustainability, systems and enterprises, modeling sustainable, environmentally-conscious manufacturing processes and systems, green supply chains, manufacturing technology for reduced impact, manufacturing technology for producing advanced energy sources or storage cleantech and sustainable products and systems. Specifically, research is focused on minimizing/removing contaminants and machining defects during manufacture, improving the precision and repeatability of chemical mechanical polishing, green machine tools and processes, sustainable packaging, and modeling sustainable, environmentally-conscious manufacturing processes and systems. The main lab groups within the LMAS are Precision Manufacturing, Green Engineering, and SMP (the Sustainable Manufacturing Partnership). An earlier research effort CODEF (Consortium on Deburring and Edge Finishing) has completed its work. Each of these groups conduct research with an eye to sustainability, and maintain a common goal of reducing waste (time, energy, materials).
There are 54 publications in this collection, published between 2001 and 2011. Showing 1 - 50.
Choi, Seungchoun; Doyle, Fiona M.; Dornfeld, David: A model of material removal and post process surface topography for copper CMP, 2011
Choi, Seungchoun; Tripathi, Shantanu; Dornfeld, David; Doyle, F M: Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4, 2010
Katahira, K.; H. Ohmori; J. Komotori; Dornfeld, David; H. Kotani; M. Mizutani: Modification of surface properties on a nitride based coating films through mirror-quality finish grinding, 2010
Teti, Roberto; Jemielniak, Krzysztof; O'Donnell, Garret; Dornfeld, David: Advanced monitoring of machining operations, 2010
Arbelaez, D; Zohdi, T I; Dornfeld, David: On impinging near-field granular jets, 2009
Shantanu Tripathi; Choi, Seungchoun; Doyle, Fiona M; Dornfeld, David: Integrated Tribo-Chemical Modeling of Copper CMP, 2009
Dornfeld, David: Opportunities and Challenges to Sustainable Manufacturing and CMP, 2009
Park, Boumyoung; Youngjin Kim; Hyoungjae Kim; Jeong, Haedo; Dornfeld, David: Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process, 2009
Park, Boumyoung; Lee, Hyunseop; Jeong, Haedo; Dornfeld, David: Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing, 2009
Tripathi, Shantanu; Doyle, F M; Dornfeld, David: Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents, 2009
Vijayaraghavan, Athulan; Dornfeld, David; Artisanal Software; Remmele Engineering Inc.: ADDRESSING PROCESS PLANNING AND VERIFICATION ISSUES WITH MTCONNECT, 2009
Vijayaraghavan, Athulan; Sodemann, Angela; Hoover, Aaron; Mayor, J.Rhett; Dornfeld, David: Trajectory generationinhigh-speed,high-precisionmicromillingusing subdivision curves, 2009
Arbelaez, D; Zohdi, T I; Dornfeld, David: Modeling and simulation of material removal with particulate flows, 2008
Childs, THC; Dornfeld, David; Min, Sangkee; Sekiya, Katsuhiko; Tezuka, Ryo; Yamane, Yasuo: The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools, 2008
Childs, THC; Sekiya, Katsuhiko; Tezuka, Ryo; Yamada, Keiji; Yamane, Yasuo; Dornfeld, David et al.: Surface finishes from turning and facing with round nosed tools, 2008
Chu, Chih-Hsing; Dornfeld, David: Geometric Approaches for Reducing Burr Formation in Planar Milling by Avoiding Tool Exits, 2008
Min, Sangkee; Sangermann, Hubertus; Dornfeld, David: A study on initial contact detection for precision micro-mold and surface generation of vertical side walls in micromachining, 2008
Vijayaraghavan, Athulan; Jayanathan, Stephen; Helu, Moneer; Dornfeld, David: DESIGN AND FABRICATION OF A ROLLER IMPRINTING DEVICE FOR MICROFLUIDIC DEVICE MANUFACTURING, 2008
Vijayaraghavan, Athulan; Hoover, Aaron; Hartnett, Jeffrey; Dornfeld, David: Improvingendmillingsurfacefinishbyworkpiecerotationandadaptive toolpathspacing, 2008
Vijayaraghavan, Athulan; Dornfeld, David A; Kim, Chang-Ju: Precision Manufacturing of Imprint Rolls for the Roller Imprinting Process, 2008
Vijayaraghavan, Athulan; Dornfeld, David: Subdivision Surfaces for Procedural Design of Optimal Imprint Rolls, 2008
Shantanu Tripathi; Adrien Monvoisin; Fiona Doyle; Dornfeld, David: CMP Modeling as a part of Design for Manufacturing, 2007
Tripathi, Shantanu; Monvoisin, Adrien; Dornfeld, David; Doyle, F M: CMP Modeling as a part of Design for Manufacturing, 2007
Vijayaraghavan, Athulan; Dornfeld, David A: Designing Imprint Rolls for Fluid Pathway Fabrication, 2007
Choi, Jihong; Tripathi, Shantanu; Hansen, David A; Dornfeld, David: Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP, 2006
Dornfeld, David; Min, Sangkee; Takeuchi, Y.: Recent Advances in Mechanical Micromachining, 2006
Iturrospe, Aitzol; Dornfeld, David; Atxa, Vicente; Abete, Jose Manuel: Bicepstrum Based Blind Identification of the Acoustic Emission, 2006
Jeong, H.; Kim, H.; Lee, Sunghoon; Dornfeld, David: Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues, 2006
Lee, D.E.; Huang, Inkil; Valente, Carlos M. O.; Oliveira, J. F.; Dornfeld, David: Precision Manufacturing Process Monitoring With Acoustic Emission, 2006
Lee, Dae-Eun; Min, Sangkee; Deichmueller, Manuel; Dornfeld, David: Variation in Machinability of Single Crystal Materials in Micromechanical Machining, 2006
Li, Xiaochun; Wong, Chee Wei; Dornfeld, David; Thomas, Brian: Research on Subwavelength Microphtonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments, 2006
Litwinski, Kai M; Min, Sangkee; Lee, Dae-Eun; Dornfeld, David; Lee, Nakkyu: Scalability of Tool Path Planning to Micro Machining, 2006
Min, Sangkee; Lee, D.E.; de Grave, A.; Valente, Carlos M. O.; Lin, J.; Dornfeld, David: Surface and Edge Quality Variation in Precision Machining of Single Crystal and Polycrystalline Materials, 2006
Min, Sangkee; Dornfeld, David; Inasaki, I; Ohmori, H.; Lee, D.; Deichmueller, Manuel et al.: Variation in Machinability of Single Crystal Materials in Micromachining, 2006
Tripathi, Shantanu; Doyle, Fiona; Dornfeld, David: Tribo-Chemical Modeling of Copper CMP, 2006
Choi, Jihong; Dornfeld, David: Chip Scale Topography Evolution Model for CMP Process Optimization, 2005
Choi, Jihong; Wang, Z.; Shen, W.; Dornfeld, David; Hsu, W.: Conditioning Effect on Pad Surface Height Distribution in Copper CMP, 2005
Lee, D. E.; Choi, Jihong; Dornfeld, David; Kim, H. J.: Graphical Mapping of AE for Pad Condition Monitoring in Copper CMP, 2005
Lee, D. E.; Choi, Jihong; Dornfeld, David A: In-Situ Acoustic Emission Monitoring of Surface Chemical Reactions for Copper CMP, 2005
Wang, C; Chandra, A.; Dornfeld, David: Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization, 2005
Choi, Jihong; Dornfeld, David A: Evaluation of the Effect of Pad Thickness and Stiffness on Pressure Non-Uniformity at Die-Scale in ILD CMP, 2004
Choi, Jihong; Dornfeld, David A: Modeling of Pressure Non-Uniformity at a Die Scale For ILD CMP, 2004
Jeong, Haedo; Kim, Hyoungjae; Lee, Sunghoon; Dornfeld, David A: Technological Approaches in Nanopolishing for Microstructures, 2004
Lee, Sunghoon; Dornfeld, David A: Pad Contact Area Characterization in Chemical Mechanical Planarization, 2004
Evans, C. J.; Paul, E.; Dornfeld, David; Lucca, D. A.; Byrne, G.; Tricard, M. et al.: Material Removal Mechanisms in Lapping and Polishing, 2003
Hwang, Inkil; Dornfeld, David A: Design Rules for the Development of a New-Concept Pad, 2003
Hwang, Inkil; Dornfeld, David A: MEMS Applications of CMP, 2003
Keppeler, Chrisian R; Dornfeld, David A: Micromilling for Mold Fabrication, 2003
Lee, Sunghoon; Dornfeld, David A: A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)-Fabrication Process and Prototype -, 2003
Luo, Jianfeng; Dornfeld, David: Material Removal Regions in Chemical Mechanical Polishing: Coupling Effects of Slurry Chemicals, Abrasive Size Distribution and Wafer-Pad Contact Area, Part 1, 2003
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